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Uitgaven door
Way Kuo
14 maart 2014
Paperback Book
Softcover Reprint of the Original 1st Ed. 1998 edition
Reliability, Yield, and Stress B...
(2014)
Way Kuo
zł 796,90
Koop
![Cover for Way Kuo · Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development (Paperback Book) [Softcover Reprint of the Original 1st Ed. 1998 edition] (2014)](https://imusic.b-cdn.net/images/item/original/968/9781461375968.jpg?way-kuo-2014-reliability-yield-and-stress-burn-in-a-unified-approach-for-microelectronics-systems-manufacturing-software-development-paperback-book&class=scaled&v=1609312561)